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Use laser flexible to high density circuit board undertakes machining handling
From;  Author:Stand originally

Article conclusion
Like copper so taller UV etchs the material of threshold value, want to use laser of high energy low repetition rate to undertake machining; And resemble getting together acyl inferior amine film material of such low threshold value, the laser that can use low energy high repetition rate only will machine, feebleminded quantity and high repetition rate are to avoid pair of copper solder dish cause damage, raise high yield can. Produce to increase can, pace of component of small treatment crossing aperture undertakes most big diameter: Get Copper Foil with UV-DPSS laser first, reoccupy CO2Laser eliminate shows a dielectric that come.



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